Title

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2016

Medilib Journal is a reliable source of researches and researches in the field of medicine. The philosophy of journals is to preserve scientific materials and register them in the name of the author and prevent plagiarism.

In 2016, the International Interconnect Technology Conference (IITC) will be held in conjunction with the Advanced Metallization Conference (AMC) Conference in San Jose, California. The 19th annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications. AMC 2016 will be the 33rd in a conference series devoted to research on materials properties and interactions of interconnect and silicide materials. IITC/AMC is issuing a Call for Papers for work describing innovative developments in the critically important field of interconnections for electronic systems. The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications.